1.Product Overview:

As a frequency-selection device, filters play a vital role in RF/microwave applications. Conventional filters are typically bulky, costly to manufacture, and difficult to integrate with monolithic ICs. By leveraging our proprietary miniaturized thin-film technology in filter design and fabrication, we have successfully developed high-performance, compact thin-film filters.
Thin-film filters are fabricated by integrating resistors, inductors, capacitors, and conductive traces into a single structure on a substrate using semiconductor processes such as sputtering, photolithography, and electroplating. Key advantages of this manufacturing approach include:
Ultra-compact size with high integration density
Exceptional dimensional precision in circuit patterning
Superior component performance with excellent uniformity
Outstanding temperature stability and frequency response characteristics

While structurally similar to cavity filters with comparable out-of-band rejection exceeding 60dB, our miniaturized thin-film filters achieve the same performance while occupying merely 1/500th the volume and weighing just 1/350th of conventional cavity filters.

2. Electrical Performance Characteristics:

3. Assembly and Operating Instructions

1) The thin-film filter is a miniaturized passive component with interchangeable RF input/output interfaces. During installation, cavity isolation is required: maintain a minimum 3mm clearance between the filter's top surface and metal shielding cover, with approximately 0.2mm sidewall clearance from the cavity.
2) The filter must be mounted on a carrier substrate with compatible thermal expansion coefficients, such as Kovar (recommended) or molybdenum-copper alloys. The carrier thickness should be ≥0.3mm (0.5mm recommended).

3)For bottom surface mounting, apply an appropriate amount of conductive adhesive (recommended ME8456 or EG8050) to ensure proper grounding while avoiding excessive contamination of RF transmission lines.

4) Ensure the chip and PCB RF traces are aligned as straight as possible. Use gold ribbon or gold wire bonding for RF connections. When employing gold wire bonding, use no fewer than 2 bonding wires and keep the interconnections as short as possible.